Use at the technology of hot frit circumfluence of small spherical treatment

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In recent years, photoetching technology flies to had replaced personal computer processing technique and quarter corrode technique. But application has a lot of restriction. The article formulates a kind of new method, technology of hot frit circumfluence is mixed between working procedure of photoetching technology develop and electroform working procedure. The miniaturization of the product, miniature turns one of main tides that are development of 21 centuries product, small part, small unit is in industry of semiconductor industry, biology technology, microelectronics, long-range communication and medical treatment industry receive wider and wider application. Imperceptible processing technique is to realize product component miniature to change basic technology, get more and more attention. Graph 1 have technology of LIGA of part of perpendicular sidewall small construction at 20 centuries 80 time the research center develops Lu Er nucleus and become by German Ka Ersi. Lithographie of LIGA You Dewen, Galvanoformung and Abformung3 the abbreviate of the word is formed, it is the perfect union that X shoots Jin deep-seated photoetching, small electroform and small duplicate craft. Suffer be restricted the high cost at X ray, kind of LIGA technology emerge as the times require such as UV-LIGA technology, Laser-LIGA technology, DEM technology, IB-LIGA technology. Be machined the limitation of the principle by photoetching technology, afore-mentioned photoetching technologies and kind photoetching technology can add a tool to have part of perpendicular parietal small construction only. A lot of miniature are made have curved surface structure, development can machine the photoetching technology extremely urgent of curved surface one kind. Article author formulates a kind of new method, technology of hot frit circumfluence is mixed between working procedure of photoetching technology develop and electroform working procedure, can make a small construction part that has globose curved surface, enlarged the applied limits of photoetching technology. Principle of technology of circumfluence of hot frit of technology of hot frit circumfluence is, on silicon substrate Tu Fuyi decides the photoetching glue of ply, use optical photoetching to make columnar array on photoetching glue, warm up to change temperature above to the glass of photoetching glue, make in order to and molecular kinetic energy as a result of tension of photoetching glue surface increase, columnar upside forms spherical appearance approximately, technological process is shown 2 times like the graph. 1988, zoran D.

The person such as Popovic puts forward to heat up frit circumfluence law, use heat the method of columnar photoetching glue, formed the photoetching glue small structure that has small globose curved surface. To control photoetching glue hot frit after forms the underside diameter of small globose curved surface, the base with a largish diameter is made in the bottom of columnar photoetching glue, add after of hot photoetching glue so, melt photoetching glue is outspread to base brim, form the globose small structure that has calm diameter, and reach heat time is more than to influence of parameter of appearance of small structure form heat the conclusion of temperature. Graph R of technological process of circumfluence of 2 hot frit.

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The person such as Shyu studies parameter of craft of hot frit circumfluence is right the influence rule of diameter of underside of small globose curved surface, reach in 6 hours heat below time, heat temperature from 200 ℃ , 300 ℃ , diameter of underside of small globose curved surface increases after to reduce first, maximum is reached when 250 ℃ ; In 250 ℃ heat below temperature, heat time arrives from 1h 9h, diameter of underside of small globose curved surface reduces after to increase first, the least value is reached in 3h. C.

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The person such as Chung uses hot flat to heat with oven the photoetching glue small structure that two kinds of different kind get small globose curved surface, discovery heats up flat to heat the small structure that means gets is more outstanding, oven heats the small structure that means gets is more even. The cause that creates this kind of appearance is flat when heating, photoetching glue and environmental temperature gradient are big, there is temperature gradient when oven heats, cause small structure evenness. The person theory such as Ren Zhibin, Lu Zhenwu was calculated the numeric relation between diameter of underside of glue of photoetching of cylinder of the after before melt and height and diameter of underside of small globose curved surface and height, the F that through shortening the method of develop time raises small lens array counts and fill factor, improve the optical performance of small lens array further. Above made globose small structure do abecedarian theory to consider to work with the experiment to heating up frit circumfluence technology, but immature still to the accurate control technology of parameter of appearance of form of globose small structure, did not form a relevant and theoretical model, the numerical value that establishs craft parameter and appearance of small structure form concerns, on the experiment very inaccessible also the control to parameter of appearance of small structure form. Technological process pursues if the photoetching technological process that core of model of 3 small lens makes technological process add craft of hot frit circumfluence pursues 3. Measure one: Of cover pattern plate make. The action of cover pattern plate is to have let be passed through solely optionally, illuminate arrives on photoetching glue, pass developer solution rinse, the graph of columnar photoetching glue that forms a need. Measure 2: Ultrasonic cleaning machine cleans silicon base, in putting the silicon base that cleans after case of vacuum male dry roast, roast time is 4h, its purpose is to evaporate the water element of silicon base surface. Be needed to set stock supersonic clean box of dry of appearance, vacuum male. Graph measure of machine of glue of 4 divide evenly 3: Stage of glue of use divide evenly, besmear is hanged on silicon base the photoetching glue of certain ply, like that after is placed in vacuum carbonado before male dry box is medium 4h. What need equipment to have box of vacuum male dry and station of divide evenly glue, if pursue,4 are shown. Measure 4: Exposure has on ultraviolet photoetching machine, choose certain time of exposure according to photoetching glue ply, be fallen to decompose in ultraviolet action by glue of exposure part photoetching. Be needed to set machine of photoetching of stock ultraviolet ray, if pursue,5 are shown. Measure 5: Set the photoetching glue of exposure and silicon base immerse in developer solution, be cleaned by developer solution by exposure photoetching glue, form the columnar small structure of a need, like that after is placed in vacuum undertake after carbonadoes in male dry box. Measure 6: Will carbonado male photoetching glue and silicon base heat on flat heater, heat the heat preservation of vitrification temperature above of photoetching glue period of time, criterion after of photoetching glue melt forms small bulbiform structure below the action of exterior tension, natural refrigeration comes room temperature. Be needed to set stock flat heating apparatus. Graph measure of machine of photoetching of 5 ultraviolet ray 7: Glue and silicon base place the photoetching melt to accuse to splash in vacuum magnetism shoot evaporate on plated film machine, in M of a 2 μ thick metallic layer regards electroform seed as the layer, like that after is placed accurate electroform undertakes on accurate electroform appearance. Be needed to set machine of stock metal plated film and accurate electroform apparatus. Measure 8: Metallic ion Shenyang accumulates certain ply, undertake to electroform the reverse side imperceptible milling is machined, machine the reverse side of level off metal. Like that after uses electroform of puissant bond felt layer and 45 steel, form the metal pattern core that needs ply. What need equipment to have accurate small milling machine. In recent years domestic investigator is in the difficulty that make photoetching respect had much research, the moulding of attack by surprise that had formed maturity makes technology, exposure technology, develop technology and electroform technology, can machine the small construction part with perpendicular sidewall. At present home still has investigator to add skill of hot frit circumfluence in photoetching technology rarely, make the small construction part that contains globose curved surface, main reason is technology of hot frit circumfluence can accuse sexual difficulty very big, influencing factor Xiao is much. Graph if the graph is shown 6 times,element of appearance of form of influence of technology of circumfluence of 6 hot frit pursues, the factor that affects appearance of form of geometry of melt photoetching glue is numerous, basically can divide it is 4 kinds big: The property of photoetching glue itself, be like tension of surface of melt photoetching glue; Silicon base property, be like exterior surface roughness, tension of silicon base surface; Heat melt parameter, if heat temperature, heat time and heat rate; For instance gravity mixes other ingredient environmental element. Current, home considers to still be in to heating up frit circumfluence technology start level. Had not begun on academic research, want to form a reasonable theoretical model, explore each influencing factor to be opposite the influence rule of parameter of appearance of form of melt photoetching glue, form the mathematical expression of an effective finally, the form that concerns with maths is conveyed. Consider to go up in the experiment, already a few investigator are done a few start the gender works, be like: The character of itself of oversight photoetching glue, use the photoetching gum with specific some; The influence of oversight environment element; The change of property of oversight silicon base, only research heats parameter, heat for instance means, heat rate, heat temperature and heat the time influence to parameter of appearance of form of globose small structure the rule. Want to realize the accurate control of parameter of pair of appearance of small structure form, need forms a maturity to heat up frit circumfluence technology. Future is looked into it is as small part, small unit in industry of semiconductor industry, biology technology, microelectronics, long-range communication and medical treatment industry receive wider and wider application, raised more and more requirements to the appearance of small structure form of small part and small part. Have part of perpendicular parietal small construction to cannot have been satisfied completely in the applied requirement of each industries, can ask according to using, the design is made have globose curved surface or the extremely urgent of small construction part of arc curved surface. Technology of hot frit circumfluence makes the new technology of small globose curved surface as a kind, will more and more attract whole world student fix eyes on. CNC Milling